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CHAUN HONG CO., LTD. | PRODUCTS
Sodium Gold Sulfite
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Product ID : SG01
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Product Categories : Gold
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Metal Content : 20%
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Product Appearance : Powder
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Product Introduction : Used in PCB, communication electronic connector and wafer semiconductor.
Detailed Introduction
The gold ion in the plating solution is mainly composed of sulfite. Add some compounding agents and additives to form a non-hydride-based gold plating solution, and the dispersion of the coating is light, high density and stable substrate adhesion. No harm to the environment, it is the best product to replace gold and potassium hydride.